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芯片阵列均匀排列的常规大功率LED模组因温度场叠加会导致中心温度过高、温度分布不均匀。在理论分析面热源温度分布函数及多热源相互影响的基础上提出了一种LED芯片外密内疏排列的模组设计方案,并与ANSYS有限元仿真的结果进行了对比验证。当芯片按照优化后的对数和幂函数分布时芯片最高温度比常规均匀排列时均低约5℃,芯片温度的方差降低约56%。外密内疏的非均匀芯片排列方案在基板较小、较薄时对散热效果的改善更好。
Conventional high-power LED modules with even arrangement of chip arrays may cause the center temperature to be excessively high and the temperature distribution to be uneven due to the superposition of the temperature fields. Based on the theoretical analysis of surface temperature distribution function and the interaction between multiple heat sources, a design scheme of LED chips with densely-spaced and densely arranged array is proposed and compared with the ANSYS finite element simulation results. When the chip is distributed according to the optimized logarithm and power function, the maximum temperature of the chip is about 5 ℃ lower than that of the conventional uniform arrangement, and the variance of the chip temperature is reduced by about 56%. Outside the dense sparse non-uniform arrangement of chips in the substrate smaller, thinner when the cooling effect is better.