目前,许多半导体制造商都在采用各种“卷盘传动式”组合焊工艺。本文对用于这类“卷盘传动式”组合焊工艺中的几种冶金结构和成分进行了评述和比较。作为背景,简要地回顾了各种组合焊接技术。比较了热压焊、硬钎焊和软釬焊等各种内引线焊接(ILB)工艺。也对各种将引线焊到线框或氧化铝基板网络上去的热压焊、熔焊和釬焊等外引线焊接(OLB)工艺作了比较。还对一、二、三层互连金属化、不同凸点结构、热压焊和釬焊工艺以及各种载体材料的特性和优缺点进行了讨论和比较。 Currently, many semiconductor manufacturers are using a variety of “reel drive” combination welding process. This article reviews and compares several metallurgical structures and compositions used in such “reel drive” hybrid welding processes. As a background, various combinations of welding techniques are briefly reviewed. Comparisons of various internal lead wire bonding (ILB) processes such as thermocompression bonding, brazing and soldering. Also compared to the various lead wire to the wireframe or alumina substrate network up to the hot-press welding, welding and soldering and other lead-wire soldering (OLB) process were compared. The characteristics, advantages and disadvantages of one, two and three-layer interconnect metallization, different bump structures, thermocompression bonding and soldering processes and various carrier materials were also discussed and compared.