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(一)引言高温钼锰法是国内普遍采用而且比较成熟的一种陶瓷金属化方法.在此工艺中为保证陶瓷与金属的封接质量,必须采用1450℃～1500℃的高温烧结工艺,由于金属化烧结温度较高,破坏陶瓷的内相均匀性,同时也改变了所设计的陶瓷体的物理性能及介电性能,从而出现瓷体弯曲和尺寸变化等现象.这对于电子器件的高可靠性的提高、保证在复杂的电子陶瓷金属封接装置中的精确公差要求都非常不利.
(A) Introduction High temperature molybdenum manganese method is a commonly used and more mature method of ceramic metallization in this process in order to ensure the quality of ceramic and metal sealing, you must use 1450 ℃ ~ 1500 ℃ high temperature sintering process, due to Metallization sintering temperature is high, the destruction of the ceramic phase uniformity, but also changed the physical properties of the design of the ceramic body and dielectric properties, resulting in porcelain body bending and size changes, etc. This is highly reliable electronic devices Increased performance and guaranteed precision tolerances in complex electronic ceramic metal sealing devices are all detrimental.