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A lead-free Sn-3.5Ag solder was prepared by rapid solidification technology. The high solidification rate, ob-tained by rapid cooling, promotes nucleation, and suppresses the growth of Ag3Sn intermetallic compounds (IMCs) in Ag-rich zone, yielding fine Ag3Sn nanoparticulates with spherical morphology in the matrix of the solder. The large amount of tough homogeneously-dispersed IMCs helps to improve the surface area per unit volume and obstructs the dislocation lines passing through the solder, which fits with the dispersion-strengthening theory. Hence, the rapidly-solidified Sn-3.5Ag solder exhibits a higher microhardness when compared with a slowly-solidified Sn-3.5Ag solder.
The high solidification rate, ob-tained by rapid cooling, promotes nucleation, and suppresses the growth of Ag3Sn intermetallic compounds (IMCs) in Ag-rich zone, yielding fine The large amount of tough homogeneously-dispersed IMCs helps to improve the surface area per unit volume and obstructs the dislocation lines passing through the solder, which fits with the dispersion of-strengthening theory , the rapidly-solidified Sn-3.5Ag solder exhibits a higher microhardness when compared with a slowly-solidified Sn-3.5Ag solder.