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1997年12月3日至4日,国家金卡工程办公室在北京主持召开了’97中国金卡工程暨IC卡应用研讨会。国家金卡工程协调领导小组副组长、电子工业部常务副部长刘剑锋出席会议并代表国家金卡工程协调领导小组作了重要讲话,国家金卡工程协调领导小组成员、国家法制局副局长李适时和国家旅游局副局长程文栋,国家计委科技司司长姜均露,中国人民银行支付与科技司司长陈静分别就金卡工程发表了意见。国家金卡工程办公室主任张琪做了《金卡工程回顾与展望》的主题报告,金十试点城市代表和中、美、德、法、英、澳大利亚、新加坡、荷兰、日本、马来西亚等国家有关信息业厂商做了20个专题技术报告,16家厂商参加IC卡新产品展
From December 3 to December 4, 1997, the State Golden Card Engineering Office hosted the ’97 China Gold Card Engineering and IC Card Application Seminar in Beijing. Liu Jianfeng, the deputy leader of the State Gold Medal Engineering Coordination Leading Group, and the Deputy Deputy Minister of the Ministry of Electronics Industry attended the meeting and made an important speech on behalf of the State Leading Group for Coordination of Gold Medal Engineering. Li Shixian, member of the Leading Group for the Coordination of National Gold Medal Projects, Mr. Cheng Wendong, Deputy Director General of CNTA, Mr. Jiang Junlu, Director of Science and Technology Department of State Development Planning Commission, and Mr. Chen Jing, Director of Payment and Technology Division of the People’s Bank of China made comments respectively on the Gold Card Project. Zhang Qi, director of the State Golden Card Engineering Office, gave a keynote report on the “Golden Card Project Review and Outlook”. Representatives from 10 pilot cities of the Golden Peninsula have offices in China, the United States, Germany, France, Britain, Australia, Singapore, the Netherlands, Japan, Malaysia and other countries Information industry manufacturers made 20 thematic technical reports, 16 manufacturers to participate in IC card new product exhibition