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以往,在气相沉积薄膜电路上形成焊接接点的方法有两种:一种是进行多层沉积继之以锡焊或熔焊,另一种是使用导电环氧树脂粘接。前一种方法操作时间长,处理困难,成本占薄膜装置成本的60%。后一种方法的主要缺点是连接电阻相对较高(比金属
In the past, there were two methods of forming soldered joints on vapor deposited thin film circuits: one was multi-layer deposition followed by soldering or welding and the other was bonding with conductive epoxy. The former method was operated for a long time and was difficult to handle, accounting for 60% of the cost of the membrane device. The main disadvantage of the latter approach is that the connection resistance is relatively high (compared to metal