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概述了挠性覆铜板、保护层和粘接片等刚挠多层FPC材料的技术开发动向,适用于制造“轻、薄、弯曲”的高性能刚挠多层FPC,以满足移动电话、DVC、DSC等电子机器日益增长的需要。
The development trend of rigid-flex multi-layer FPC materials such as flexible CCL, protective layer and adhesive sheet is summarized. It is suitable for manufacturing “light, thin and curved” high performance RLC multi-layer FPC to meet the requirements of mobile phone, DVC , DSC and other electronic machines growing needs.