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Diodes公司(Diodes Incorporated)推出首款采用了晶圆级芯心尺寸封装的肖特基(Schottky)二极管,为智能手机及平板电脑的设计提供除微型DFN0603器件以外的又一选择。新器件能够以同样的电路板占位面积,实现双倍功率密度。全新30 V及0.2 A SDM0230CSP肖特基二极管采用了X3-WLCUS0603-3焊接焊盘封装,热阻仅为261 oC/W,比DFN0603封装低约一半,有效把开关、反向阻断和整流电路的功耗减半。SDM0230CSP的占位面积为0.18 mm~2,比采用了行业标准的DFN1006及SOD923封装的肖特基二极管节省电路板面积达70%,非常适合高密度的设计。
Diodes Incorporated introduced the first Schottky diode in a wafer-level core-size package to offer smart phone and tablet designs an alternative to the tiny DFN0603 device. The new device achieves double power density with the same board footprint. The new 30 V and 0.2 A SDM0230CSP Schottky diodes feature an X3-WLCUS0603-3 solder-land package with a thermal resistance of only 261 oC / W, about half the package size of the DFN0603, effectively turning the switch, reverse blocking, and rectifier circuits Half the power consumption. With a footprint of 0.18 mm 2, the SDM0230CSP saves 70% more board space than Schottky diodes in the industry-standard DFN1006 and SOD923 packages, making them ideal for high-density designs.