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一年一度的中国半导体封装测试技术与市场调研报告定稿会于4月7日在广州市三寓大酒店举行。中国半导体行业协会封装分会毕克允理事长、封装分会赵勃副秘书长出席
The annual China semiconductor packaging and testing technology and market research report will be finalized on April 7 in Guangzhou Suda Apartment Hotel. China Semiconductor Industry Association Packaging Branch Bi Keyun chairman, packaging branch attended the Deputy Secretary-General Zhao Bo