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引言印制电路板焊点质量问题是所有电气生产和使用部门所普遍关心的问题。在电子仪器生产中,印制电路板焊点数量最多,平均每平方英尺均有2000个焊点,往往一台计算机就有数十亿个焊点。一家规模很大的计算机制造厂研究结果表明,波峰焊机的2000个焊点中致少有一到四个点是有缺陷的,即每平方英尺的线路板平均致少有两个缺陷焊点。美军用技术规范手册217号文件上统计,对于穿孔的双面线路板,焊点的故障率为6×10~(-6)/10~6小时。因此导求自动化,高可靠的焊点缺陷检测手段是当前急需解决的技术难题。
Introduction Printed circuit board solder joint quality is a common concern of all electrical manufacturing and consumer sectors. In the production of electronic equipment, printed circuit board solder the largest number, an average of 2000 per square foot solder joints, often a computer billions of solder joints. A large computer factory found that a minimum of one to four out of 2,000 solder joints in a wave soldering machine were flawed, meaning an average of two defective solder joints per square foot of circuit board. US military specifications manual No. 217 document statistics, for perforated double-sided circuit boards, solder joint failure rate of 6 × 10 -6 / 10 ~ 6 hours. Therefore, the demand for automated, highly reliable solder joint defect detection means is a technical problem that needs to be solved urgently.