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IBM 公司用玻璃钝化面结型半导体片的最早的成功的方法是将玻璃粒子的胶状料熔解在片子上,这种胶状料是用离心淀积技术均匀地甩在表面上的。能够用这种方法进行淀积的许多种玻璃具有广泛的物理、机械、化学特性和熔点。
One of the earliest successful ways for IBM to use glass-passivated junction semiconductor wafers was to melt the glass particles in a film that was evenly deposited on the surface by centrifugal deposition. Many glasses that can be deposited in this way have a wide range of physical, mechanical, chemical properties and melting points.