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针对金属化电迁移 ,进行了失效机理与工艺相关性的研究 ;确定了金属晶粒尺寸与金属化可靠性之间存在着直接关系 .金属平均晶粒直径与金属电迁移寿命受金属化溅射工艺条件的影响完全一致 .提出了平均晶粒直径作为能够表征金属化可靠性的特征工艺参数的概念和金属化可靠性在线评价方法 .
Aiming at the electromigration of metallization, the relationship between failure mechanism and process was studied, and it was confirmed that there was a direct relationship between the size of the metal and the reliability of the metallization.The average grain size and the electromigration lifetime of the metal were affected by metallization and sputtering The influence of process conditions is exactly the same.The average grain diameter is proposed as the characteristic process parameter characterizing the reliability of metallization and the online evaluation method of metallization reliability.