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采用快速周转的单片工艺进行IC生产，可避免传统成批处理的不灵活性和高费用问题。一个柔性的单片微型工厂包括34个与各种工艺能源（Processenergysources）和原位监测和控制探测器相结合的单片处理器。用模块系统完成四十种不同的器件生产工艺，其系统中大部分是先进的真空处理器（AVP）。真空盒用来在设备之间净化的环境中传递硅圆片。AVP由计算机集成制造（CIM）系统驱动和监控。现已开发出典型的0．35μmCMOS技术中所需的所有热加工步骤的快速热处理（RTP）AVP用单片设备和全RTP处理已成功地验证了完整的工艺集成和三天的制造周期。
IC production with a fast turnaround monolithic process avoids the inflexibility and high cost of traditional batch processing. A flexible single-chip micro-plant includes 34 single-chip processors combined with various Processenergysources and in-situ monitoring and control probes. Forty different device manufacturing processes are done using the modular system, most of which are Advanced Vacuum Processors (AVPs). Vacuum boxes are used to transfer silicon wafers in a clean environment between devices. AVP is driven and monitored by a Computer Integrated Manufacturing (CIM) system. Rapid Thermal Processing (RTP) has been developed for all thermal processing steps required in a typical 0.35μm CMOS technology. AVP has successfully demonstrated complete process integration and three-day manufacturing cycle with single-chip devices and full RTP processing.