一、引言 随着电子技术的飞跃发展,对半导体分立器件的电学性能和可靠性要求越来越高。同时,提高器件的生产效率、降低成本、减少原材料的消耗等是一个十分重要的问题。目前国内有些单位采用电子数字程序控制线切割机切割多片叠层的高压硅堆管芯,但对单片管芯的切割尚无成功的报导。本文将讨论在采用台面工艺的高频整流、电源整流、阻尼、升压等硅二极 I. INTRODUCTION With the rapid development of electronic technology, the electrical performance and reliability requirements of discrete semiconductor devices are getting higher and higher. At the same time, to improve the production efficiency of the device, reduce costs and reduce the consumption of raw materials is a very important issue. At present, some domestic units adopt the electronic digital program control line cutting machine to cut the multi-piece laminated high-voltage silicon pile die, but there is no successful report on cutting the single-piece die. This article will discuss the use of mesa technology, high-frequency rectifier, power rectifier, damping, such as silicon diode boost