近年来,人们正议论超大规模集成电路的研制问题。随着集成电路、大规模集成电路加工精度的提高及精细化和高集成化,光刻胶已接近于加工精度极限。目前,4～5微米条宽的加工工艺已经成熟,而且正用于批量生产中,预计今后图形加工技术将稳定地达到2～3微米或更窄的条宽。因此,曝光方式、清洗设备和腐蚀技术等一系列工艺都必须进行改进,以建立起能使分辨率和粘附性都稳定而且 In recent years, people are talking about the development of very large scale integrated circuits. With the improvement of the processing precision of integrated circuits and large-scale integrated circuits and the refinement and high integration, the photoresist is close to the processing accuracy limit. At present, 4 ~ 5 micron width of the processing technology has matured, and is being used in mass production, the future graphics processing technology is expected to be stable to 2 ~ 3 microns or narrower width. Therefore, a series of processes such as exposure method, cleaning equipment and etching technology must be improved in order to establish a stable and stable resolution and adhesion