论文部分内容阅读
复合材料、用其制作的高频电路基板及其制作方法 /CN102850726A/广东生益科技股份有限公司/曾宪平,陈广兵摘要:本发明涉及一种复合材料、用其制作的高频电路基板及其制作方法,该复合材料包括组分及其体积百分比如下:聚醚酰亚胺增强材料10~90%及热固性树脂组合物10~90%。使用该复合材料制作的高频电路基板,包括:数层互相叠合的半固化片及压覆于该叠合的半固化片一侧或两侧上的铜箔,该数层半固化片中至少一张半固化片由所述复合材料制作。本发明的复合材料,通过采用
Composite material, high-frequency circuit substrate made thereof and manufacturing method thereof CN102850726A / Guangdong Shengyi Technology Co., Ltd. / Zeng Xianping, Chen Guangbing Abstract: The present invention relates to a composite material, Method, the composite material comprises the following components in percentage by volume: 10-90% of polyetherimide reinforcing material and 10-90% of thermosetting resin composition. A high frequency circuit board made of the composite material comprises a plurality of prepregs and a plurality of copper foils laminated on one or both sides of the superposed prepregs, at least one of the plurality of prepregs is made of Composites production. The composite material of the present invention is adopted