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研究了一种具有广泛适应性的微机械制造方法,该方法可用于制备各种不同的器件,包括硅微陀螺仪、加速度计、剪切应力传感器以及光开关等。利用该方法,制备了硅微陀螺仪,并给出了所制备的硅微陀螺仪的性能测试结果,同时分析了利用该制备方法制备各种不同器件时,工艺流程对器件性能的影响,重点讨论了硅-玻璃阳极键合、减薄工艺以及深刻蚀所形成的侧壁质量,包括侧壁垂直度、侧壁杂质等因素对器件性能的影响。
A widely adaptable micromachined manufacturing method is studied, which can be used to fabricate a variety of different devices including silicon micro-gyroscopes, accelerometers, shear stress sensors and optical switches. Using this method, a silicon micro-gyroscope was prepared and the performance test results of the silicon micro-gyroscope were given. Meanwhile, the influence of process flow on the performance of the devices when the devices were prepared by this method was analyzed. The key points The effects of silicon-glass anodic bonding, thinning process and the quality of the sidewalls formed by deep etching are discussed, including the effects of sidewall verticality, sidewall impurities and other factors on device performance.