To obtain novel intermediate temperature alloy solders with a melting temperature of 400-600C, nominal (Ag-Cu2s)-30Sn al......

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为实现面积阵列封装中焊料凸点阵列的快速制备，提出了一种气动膜片活塞式熔融焊料微滴按需喷射装置．该装置利用微滴按需喷射技术对焊......

研究了Sn、Sb、Bi、P、CA五种合金元素对Pb-Sn-Sb-Bi-P-CA系软钎料的熔化温度、润湿性能、抗剪强度等性能的影响．结果表明，加入适量......

熔化温度范围（包括固相线和液相线温度）是关系到焊料使用性能的基本参数之一，但目前对其测试的方法较多。对SJ／T11390-2009，GB／T1425—19......

将铟含量不同的Al-Si-Mg-In焊料与A1-Mn芯材制成复合带材,研究了铟对复合带性能的影响.结果表明:铟含量对焊料与芯材的热复合性能......

为了获得新奇中间的温度，合金与 400600 的融化的温度焊接...

In the present work, the effect of Ni doping on the microstructures and properties of Zn-20 Sn high temperature lead-fre......

The bond strength of the Sn based ternary active solders,Sn-5Ti with various contents of Ag,Cu,In,Ni or AI on sialon cer......

The creep phenomenon is considered as one of the most important deformation mechanisms under working conditions. The pre......