研究了球磨机加工半导体制造用SiC粉末过程中中位径与表面积的对应关系,中位径随研磨时间变化的函数关系,不同研磨时间粉体的粒度分布变化,通过分析得到数学表达式。 The relationship between the median diameter and the surface area of ​​the SiC powder for the semiconductor manufacturing process was studied. The function of the median diameter as a function of the milling time and the variation of the particle size distribution of the powders at different milling time were obtained. The mathematical expressions were obtained through the analysis.