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一、消化生产的目的与意义多层印制板层压的一个重要质量标志是层压粘结强度。其影响因素,除半固化片粘结材料的特性和层压工艺外,各个内层导体图形的表面处理也是至关重要的。在目前国内外所采取的表面处理工艺中,除预处理(其中包括清洁、微腐蚀、活化)外,最重要的环节就是铜表面的化学氧化处理或粗化处理。从目前来看,化学氧化处理可比粗化处理获得更高的粘结强度。所谓化学氧化处理,也就是通常所指的黑化处理。它是利用化学试剂处理铜导体表面,使其形成黑色或棕色的氧化铜或氧化亚铜。这
First, the purpose and significance of digestion and production Multilayer PCB laminate is an important quality mark is laminated bond strength. The influencing factors, in addition to the characteristics of the prepreg bonding material and the lamination process, the surface conductor of each inner conductor is also crucial. In the current domestic and foreign surface treatment process, in addition to pretreatment (including cleaning, micro-corrosion, activation), the most important part is the copper surface chemical oxidation treatment or roughening treatment. From the current point of view, chemical oxidation treatment can get higher bond strength than the roughening treatment. The so-called chemical oxidation, which is commonly referred to as blackening. It is the use of chemical reagents treatment of copper conductor surface, making it the formation of black or brown copper oxide or cuprous oxide. This