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为了确认抛光过程中抛光盘大小对光学元件表面中频误差的影响,对双轴式平面研磨抛光的去除特性进行了分析。推导了去除函数的表达式,计算了抛光盘大小对元件的去除量以及其分布的影响。结果表明,不论抛光盘大小如何改变,回转中心的去除量总是最大,去除量最大区域所对应半径随着抛光盘半径的增大而增大,利用这一关系确定了导致中频误差产生的磨头尺寸。通过选择合适的抛光盘尺寸,可以对最大去除量区域范围进行控制,从而有效减少工件在研磨抛光过程中中频误差的产生。
In order to confirm the effect of the polishing disc size on the mid-frequency error of the surface of the optical element during polishing, the removal characteristics of the biaxial plane polishing were analyzed. The expression of the removal function is deduced, and the effect of the polishing disc size on the removal amount of the component and its distribution is calculated. The results show that irrespective of the size of the polishing disc, the removal of the rotation center is always the largest, and the radius corresponding to the largest area of the removal increases with the increase of the radius of the polishing disc. By using this relationship, it is determined that the intermediate frequency error Head size. By selecting the appropriate size of the polishing disc, the range of the maximum removal amount can be controlled, so as to effectively reduce the intermediate frequency error of the workpiece during the polishing process.