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针对组合式片状放大器工作时的热量沉积特性，分析了氙灯箱和片腔的冷却过程，重点研究了激光介质钕玻璃片的热恢复过程。初步的热分析表明，为每支氙灯提供４．７Ｘ１０－３ｍ３／ｓ的冷却气量以及为每个片腔提供７．６×１０－３ｍ３／ｓ的冷却气量时能够满足装置４小时一发的运行频率要求。
Aiming at the heat deposition characteristics of the combined chip amplifier, the cooling process of the xenon lamp box and the chip cavity is analyzed. The heat recovery process of the neodymium glass plate with laser medium is emphatically studied. Initial thermal analysis shows that the 4-hour operation of the unit can be satisfied by providing 4.7 x 10-3 m 3 / s of cooling gas per xenon lamp and 7.6 x 10 -3 m 3 / s of cooling gas per chamber Frequency requirements.