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ＭＣＭ是最佳封装技术吗？ＭＣＭｓ：Ｐａｃｋａｇｉｎｇ’ｓＦｉｎａｌＦｒｏｎｔｉｅｒ？ＲｏｎＩｓｃｏｆｆ等尽管ＭＣＭ被誉为未来的主要封装技术，但它仍面临着一些技术和经济方面的难题。多芯片组件（ＭＣＭ）的发展正处在红热阶段，它是ＩＣ封装革命的一个重要组成...
MCM is the best packaging technology? MCMs: Packaging’sFinalFrontier? RonIscoff, etc. Although MCM is known as the future of the main packaging technology, but it still faces some technical and economic problems. Multi-chip module (MCM) is in the red hot stage of development, it is an important component of IC packaging revolution ...