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应用严格耦合波分析方法(RCWA),在本征硅片衬底表面设计并制作了一种圆柱形抗反射微结构元件。通过MATLAB软件模拟仿真确定其最优参数组合,使反射率设计值为3%。应用二元曝光技术和反应离子刻蚀技术制作了单面和双面的圆柱形微结构,根据结果得到射频功率、气体流量及工作气压对微结构侧壁陡直度及形貌具有很大影响。还分析比较了形状(t为实际柱顶面直径与底面直径之比)与反射率的关系。采用热场发射扫描电子显微镜对该结构进行形貌表征,综合显微成像红外光谱仪对反射率进行测量。实验结果:制作了单面、双面微结构与无结构本征硅片反射率做比较双面圆柱形微结构的抗反射效果最好,反射率达8%左右,基本达到抗反射设计要求。
Using a rigorous coupled wave analysis (RCWA) method, a cylindrical anti-reflective microstructure element was designed and fabricated on the surface of an intrinsic silicon substrate. Through MATLAB software simulation to determine the optimal combination of parameters, the design of the reflectivity value of 3%. The single-sided and double-sided cylindrical microstructures were fabricated by binary exposure and reactive ion etching. According to the results, RF power, gas flow rate and working pressure have great influence on the steepness and topography of the microstructured sidewalls . Also analyzed and compared the shape (t is the actual diameter of the top surface of the diameter of the diameter of the bottom) and reflectance. The structure was characterized by thermal field emission scanning electron microscopy, and the reflectance was measured by a comprehensive microscopic imaging infrared spectrometer. Experimental results: The single-sided, double-sided microstructure and non-structural intrinsic silicon reflectance compared to double-sided cylindrical microstructure of the best anti-reflection effect, the reflectivity of about 8%, basically meet the anti-reflection design requirements.