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当提高安装密度时,导线间的距离很近,电路基片上很难钻安装孔,在多层电路基片的情况下更难办。本文提出了混合集成电路的平面结构,为了将它安装在电路基片上,不需要钻孔。微小的金属凸点或合金球在此种混合集成电路中起引线作用,所用合金为铅锡合金,熔点低,凸点或合金球从垫片的反面焊到混合集成电路的接触区。用电解沉积、浸锡或熔融的办法形成这些凸点。形成微小引头的
When increasing the mounting density, the distance between the wires is very close, making it difficult to drill the mounting holes on the circuit substrate, making it more difficult in the case of multilayer circuit substrates. This paper presents a planar structure of a hybrid integrated circuit that does not require drilling to mount it on a circuit substrate. Tiny metal bumps or alloy balls serve as lead wires in this hybrid IC. The alloy used is a lead-tin alloy with a low melting point. Bumps or alloy balls are soldered from the underside of the pad to the contact area of the hybrid IC. These bumps are formed by electrolytic deposition, immersion or melting. The formation of tiny lead