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在陶瓷衬底的金属化图形及其互连上化学镀镍,对生产高可靠、结构坚固、高电路密度的电子设备中,起着重要的作用。金属化陶瓷衬底经化学镀镍后,能满足固体微电子器件的严格设计要求。
Electroless nickel plating on the metallized patterns of ceramic substrates and their interconnections plays an important role in the production of electronic devices that are highly reliable, robust and have high circuit density. Metallized ceramic substrate after electroless nickel plating, solid microelectronic devices to meet the stringent design requirements.