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用于材料加工的激光器数量正在增多,美国工业界约有6000台,芝加哥伊利诺斯理工学院研究所经理 F.D.Seaman 最近预期,到本世纪末,这类激光器数目将增加五倍。未来增长的一个主要部分是金属的表面处理(包括热处理)。迄今,电子学制造和装配占据激光材料处理用途的大部分(见图1),应用范围从集成电路元件的晶片修正到元件板的焊接。非电子学应用部分,在取代传统的切割、打孔和焊接技术方面已取得一些进展,各种特殊的激光应用也得到发展。
The number of lasers used for material processing is on the rise, with about 6,000 in the US industrial community, and F.D.Seaman, manager of the Institute of Technology at Illinois Institute of Technology in Chicago, recently expected that the number of such lasers will increase fivefold by the end of this century. A major part of the future growth is metal surface treatment (including heat treatment). To date, electronics manufacturing and assembly occupy the majority of laser material processing applications (see Figure 1), ranging from wafer correction of integrated circuit components to component board soldering. Non-electronic applications have made some progress in replacing the traditional cutting, drilling and welding technologies, and various special laser applications have also been developed.