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在混合微电路制造中已经用过好几种群焊接技术来取代线焊法,但至今还没有一种达到普遍接受程度。近几年来,载带技术,典型的称为载带自动焊接工艺(简称 TAB 工艺),获得人们的重视。凸点载带自动焊接工艺(简称 BTAB 工艺)是一项新的发展,它除了保留常规 TAB 工艺的优点外,还具有自己的特色,能与常规铝金属化集成电路芯片很好的配合。本文从混合微电路生产实际和性能角度出发来介绍 BTAB 工艺目前的发展情况。
Several group welding techniques have been used to replace wire bonding in the fabrication of hybrid microcircuits, but to date none of them have reached a general acceptance level. In recent years, with the carrier technology, typically known as carrier tape with automatic welding process (referred to as TAB process), access to people’s attention. Bump carrier tape automatic welding process (referred to as BTAB process) is a new development, it not only retains the advantages of conventional TAB process, but also has its own characteristics, with conventional aluminum metallized integrated circuit chips with a good fit. This article introduces the current development of BTAB process from the perspective of the actual production and performance of hybrid microcircuits.