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本文着重叙述以MIL-STD-1750A为基础的任务处理机系统结构。它最早由得克萨斯仪表公司(TI)于1989年3月生产;采用模块间通信用的双重VHSIC第2阶段TM总线和双重VHSIC第2阶段PI总线。任务处理机包括在空气冷却机箱内的18个表面安装SEM-E模块和带18层G10母板的5个高密度电源。系统级接口包括一个模块间通信用的双重PI总线;一个模块间操作测试和维修用的双重TM总线;一个连接外部软件开发平台的IEEE-488接口;两个差分式小型计算机系统接口(SCSI)总线;三个双余度MIL-STD-1553B串行通信总线,和若干离散的数字与模拟I/O接口。 本文介绍了每个基本PI总线消息的所定义的周期序列与系统中这些消息类型的观测周期结构的对比。考察了链接PI总线消息序列的影响。最后介绍了在各种条件下PI总线数据传输量对模块性能的影响。
This article focuses on the task processor architecture based on MIL-STD-1750A. It was first produced by Texas Instruments in March 1989; dual VHSIC Phase 2 TM bus and dual VHSIC Phase 2 PI bus for inter-module communication. The task processor consists of 18 surface-mount SEM-E modules and 5 high-density power supplies with 18-layer G10 motherboards in an air-cooled chassis. The system-level interface includes a dual PI bus for inter-module communication; a dual TM bus for interoperability testing and maintenance; an IEEE-488 interface to an external software development platform; two differential small computer system interface (SCSI) Bus; three dual redundancy MIL-STD-1553B serial communication bus, and a number of discrete digital and analog I / O interface. This article describes a comparison of the defined periodic sequences for each basic PI bus message with the observed periodic structure of these message types in the system. Examines the impact of linking PI bus message sequences. Finally, the influence of PI bus data transmission on module performance under various conditions is introduced.