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研究了微量铈对Sn57Bi1Ag焊料合金性能(物理性能、润湿性能及力学性能等)与组织的影响。结果表明,与Sn57Bi1Ag焊料合金相比,添加铈的作用较明显,适量的铈可有效细化组织,抑制焊料/Cu界面的金属间化合物的生长;能略微降低焊料熔化温度;但是提高了焊料合金的电阻率;未能改善焊料合金的耐蚀性能;当铈含量(质量分数)为0.05%时,焊料有较好的润湿性。当铈含量为0.05%～0.25%时焊料合金具有较好的综合性能。
The effects of cerium on the properties (physical properties, wettability and mechanical properties) and microstructure of Sn57Bi1Ag solder alloy were investigated. The results show that, compared with Sn57Bi1Ag solder alloy, the addition of cerium is more obvious. The appropriate amount of cerium can effectively refine the microstructure and inhibit the growth of the intermetallic compound at the solder / Cu interface; the melting temperature of solder can be slightly reduced; but the solder alloy Of the resistivity; failed to improve the corrosion resistance of solder alloys; when the cerium content (mass fraction) of 0.05%, the solder has better wettability. When the content of cerium is 0.05% ~ 0.25%, the solder alloy has good comprehensive properties.