传统的倒装芯片无损检测技术并不能完全满足倒装焊检测需要,为此提出了一种基于主动红外的倒装芯片缺陷检测方法。通过非接触方式对倒装芯片施加热激励,并结合红外测温设备检测芯片温度分布情况,从而对芯片内部缺陷进行诊断与识别。实验研究表明,该方法能较好地检测出倒装焊点缺陷,可应用于倒装焊芯片的缺陷检测与诊断研究。 The traditional flip-chip non-destructive testing technology can not fully meet the needs of flip-chip testing. To solve this problem, an active infrared based flip-chip defect testing method is proposed. Through the non-contact method, the thermal excitation is applied to the flip chip, and the temperature distribution of the chip is detected by the infrared temperature measuring device to diagnose and identify the chip internal defects. Experimental results show that this method can detect the defects of flip-chip solder well and can be applied to the defect detection and diagnosis research of flip-chip.