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考察了over-plating工艺中不同线距、线宽条件下的电沉积规律。利用数值模拟方法对图形结构轮廓和电沉积速度之间的相互影响进行了分析,同时采用变网格方法来适应电沉积过程中结构轮廓的不断变化。数值模拟结果表明:当线距/线宽较大( >12)时,相邻图形的电沉积速度受到的影响很小,图形的横向和纵向的电沉积速度逐渐趋于一致;而当线距/线宽较小( <6)时,相邻电沉积图形之间相互影响显著,线距/线宽越小,纵向电沉积速度和横向电沉积速度之比越大,因此相邻电沉积图形中间区域可能产生空洞,从而出现电镀缺陷的情形。对于上述工艺缺陷,可以通过增加辅助导电层进行消除,实验结果表明效果良好。
The law of electrodeposition under different line spacing and linewidth in over-plating process was investigated. The interaction between the contour of the structure and the electrodeposition velocity was analyzed by numerical simulation method. At the same time, the variable mesh method was used to adapt to the change of structure contour during electrodeposition. The numerical simulation results show that when the line pitch / linewidth is large (> 12), the electrodeposition speed of the adjacent patterns is less affected, and the horizontal and vertical electrodeposition speed of the pattern gradually converges. When the line pitch / Line width is smaller (<6), the adjacent electrodeposition patterns significantly affect each other, the line / line width is smaller, the vertical electrodeposition rate and the transverse electrodeposition rate is greater, so the adjacent electrodeposition pattern The middle area may be hollow, resulting in plating defects. For the above process defects, can be eliminated by adding an auxiliary conductive layer, the experimental results show that the effect is good.