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对Si/Glass激光键合进行了有限元仿真,自主设计激光键合系统并进行了Si/Glass激光键合实验研究、测试与表征。以Si/Glass激光键合的二维传热解析模型为理论基础,应用有限元软件ANSYS仿真了激光功率20～48W时激光键合的三维温度场、键合熔融深度,并预测键合阈值功率为28 W。自主设计激光键合系统及实验方案,采用光斑直径150μm、功率30W的Nd:YAG连续激光实现了Si/Glass的良好激光键合。测试结果表明,激光键合强度最高为阳极键合的5.2倍,激光键合腔体气密性测试泄漏率平均值约9.29×10-9 Pa.m3/s,与阳极键合处于同一数量级。采用能谱分析(EDS)线扫描Si/Glass激光键合的界面材料成分,发现键合界面形成过渡层,激光功率30W时过渡层厚度9μm,与仿真结果吻合。
The finite element simulation of Si / Glass laser bonding was carried out. The laser bonding system was independently designed and the Si / Glass laser bonding experiment, testing and characterization were carried out. Based on the two-dimensional heat transfer analytical model of Si / Glass laser bonding, the finite element software ANSYS was used to simulate the laser-bonded three-dimensional temperature field, bond melting depth and the predicted threshold power at laser power of 20 ~ 48W 28 W Independent design of the laser bonding system and experimental scheme, the good laser bonding of Si / Glass was achieved with Nd: YAG continuous laser with spot diameter of 150μm and power of 30W. The results show that the highest laser bonding strength is 5.2 times that of the anodic bonding and the average leak rate of the laser bonding cavity is about 9.29 × 10-9 Pa.m3 / s, which is in the same order of magnitude as that of the anodic bonding. The interface of the Si / Glass laser-bonded interface material was scanned by EDS. The interface of the interface was found to be the transition layer. The thickness of the transition layer was 9μm when the laser power was 30W, which was consistent with the simulation results.