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提出了一种应用网络分布式计算即 CORBA技术进行半导体器件并行模拟的新技术 ,讨论了基于 CORBA的网络分布式平台上的并行设计方法 ,最后将并行模拟的结果与串行模拟软件 SMDS1.0的模拟结果进行比较 ,验证了该技术的先进性和有效性。
A new technology for parallel simulation of semiconductor devices based on distributed computing (CORBA) is proposed. The parallel design method based on CORBA is discussed. Finally, the results of parallel simulation are compared with those of serial simulation software SMDS1.0 The simulation results verify that the technology is advanced and effective.