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自动载带焊接(ATCB)技术,是一种新型的微电子器件组焊技术。它具有组装成本低、焊接质量可靠、生产效率高等优点,是目前半导体集成电路组焊技术高度自动化的主要方向。本文在介绍国外ATCB技术现状的基础上,着重介绍硅圆片凸点制造、载带设计和制造、载带规格和应用以及内、外引线组焊和自动载带组焊设备等ATCB技术的主要组成内容。
Automatic carrier tape welding (ATCB) technology, is a new type of microelectronic device welding technology. It has the advantages of low assembly cost, reliable welding quality and high production efficiency. It is the main direction of highly automated welding technology of semiconductor integrated circuits. Based on the introduction of the status quo of foreign ATCB technology, this paper focuses on the main topics of ATCB technology such as manufacturing of silicon wafer bumps, design and manufacture of carrier tapes, specifications and applications of carrier tapes, and welding of internal and external leads and automatic tapes. Composition of content.