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随着电子芯片发展的高度集成化,散热问题日益凸显,芯片微通道散热器以其优越的散热性能而被广泛应用。文章从影响微通道散热器性能的主要因素,即流动工质、微通道结构、制作材料三个方面对最新研究成果进行综述。通过对各种研究结果的分析,发现一些常规槽道中被忽略的因素,如槽道宽高比、进出口效应、表面粗糙度、槽道孔隙率等会对芯片微通道散热器的换热性能产生较大的影响。同时指出了目前研究工作中存在的不足,展望了芯片冷却用微通道散热器的发展前景,并提出了新的研究思路。
With the highly integrated electronic chip development, cooling issues have become increasingly prominent, the chip microchannel heat sink for its superior thermal performance has been widely used. The article summarizes the latest research results from the following three aspects: the main factors influencing the performance of microchannel radiators, that is, the working fluid, microchannel structure and materials. Through the analysis of various research results, it is found that some factors neglected in the conventional channels, such as channel aspect ratio, import and export effects, surface roughness, channel porosity, etc., can affect the heat transfer performance of the chip microchannel heat sink Have a greater impact. At the same time, it pointed out the shortcomings in the current research work, and forecasted the development prospect of microchannel heat sinks for chip cooling and put forward new research ideas.