一、引言元器件的集成化和产品的小型化,将影响生产的效能费用比和管理体制。对电子设备来说,集成化、小型化所带来的突出问题之一,是随着功率密度的提高,散热问题成为影响电子设备可靠性和寿命的重要环节,因而热设计已成为当前电子设备结构设计的一个主要组成部分,在某种情况下甚至是影响设备命运的关键问题。某些大型计算机所采用的庞人的冷却 I. INTRODUCTION The integration of components and miniaturization of products will affect the production cost-effectiveness ratio and management system. One of the outstanding problems that the integrated and miniaturized electronic equipment brings is that with the increase of the power density, the issue of heat dissipation has become an important link that affects the reliability and life expectancy of the electronic equipment. Therefore, the thermal design has become the current electronic equipment A key component of the structural design is, in some cases, even the key issue that affects the fate of the equipment. The cooling of the plutonium used by some of the big computers