文章介绍了返修工作站拆焊及局部再流焊接温度曲线的摸索,粘贴热电偶方法,印制板保护方法,并对试件进行拆焊及焊接试验验证,总结温度曲线的注意事项及典型不合格温度曲线,最后对试件进行微观视觉检测和金相分析,检查焊点和印制板的质量,验证返修工艺参数的可靠性。 This article introduces the rework station soldering and local reflow soldering temperature curve of the exploration, paste the thermocouple method, printed circuit board protection methods, and the test pieces of the desoldering and welding test verification, summarizes the temperature curve precautions and typical failure Temperature curve, the final microscopic visual inspection of the specimen and the metallographic analysis, check the quality of solder joints and printed circuit board to verify the reliability of rework process parameters.