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制备了乙烯基苯基硅油、含氢硅树脂及乙烯基硅树脂,在铂催化剂的作用下,乙烯基苯基硅油、含氢硅树脂及乙烯基硅树脂按照一定比例混合后于150℃固化1h制得封装用有机硅树脂材料,并对硅树脂材料进行了红外光谱、光透过率、折射率、表观粘性、高低温稳定性及耐热性能表征。结果表明,固化制得的硅树脂材料具有高折光率(>1.54)、高透光率、良好的耐热性及热冲击稳定性,可用于LED封装材料。
The vinyl phenyl silicone oil, hydrogen-containing silicone resin and vinyl silicone resin were prepared. After the vinyl phenyl silicone oil, the hydrogen-containing silicone resin and the vinyl silicone resin were mixed in a certain proportion under the action of the platinum catalyst, they were cured at 150 ° C. for 1 h The encapsulated silicone resin was prepared and characterized by IR, optical transmittance, refractive index, apparent viscosity, high and low temperature stability and heat resistance. The results show that the cured silicone material with high refractive index (> 1.54), high transmittance, good heat resistance and thermal shock stability, can be used for LED packaging materials.