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设计并试制了由软光刻法转印,可敷设在印刷电路板上用于芯片间互连的光学互连线路。提出了一种新颖的端口耦合结构,并发现在耦合适配段长度与接收窗口的长度比值为12∶1时耦合效率最佳,且该耦合结构有效降低了对安装精度的要求;分析了该光学互连线路在交叉布线时的基本准则,获得对于不同横截面矩形波导结构在交叉布线时呈现的串扰与交叉角度的相关性,并发现在强束缚下交叉角度大于54°的交叉结构都能达到低串扰(小于-30 dB)。采用软光刻技术制作了上述高聚物波导光学互连线路元件,实验测量结果与设计数据符合较好。与传统的光刻或激光直写技术相比,软光刻转印具有制作简单,易于实现高聚物三维结构的大批量高精度复制。
An optical interconnection circuit that is transferred by soft lithography and can be laid on a printed circuit board for inter-chip interconnection is designed and fabricated. A novel port coupling structure is proposed and it is found that the coupling efficiency is best when the ratio of the length of the coupling adapting section to the length of the receiving window is 12: 1, and the coupling structure effectively reduces the requirement for the installation precision. The optical The basic criteria for interconnecting wiring in cross-wiring is to obtain the correlation between cross-talk and cross-angle for cross-hatched rectangular waveguide structures at cross-wiring and to find that cross structures with cross angles greater than 54 ° Crosstalk (less than -30 dB). The above polymer waveguide optical interconnection circuit elements are fabricated by soft lithography, and the experimental measurement results are in good agreement with the design data. Compared with the traditional lithography or laser direct writing technology, soft lithography transfer has the advantages of simple manufacture and easy realization of large-volume and high-precision replication of polymer three-dimensional structure.