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清华大学无线电电子学系于83年承担了电子工业部下达的“控制热涂铅锡合金铜芯引线中间过渡层增长”的科研任务。他们在完成机理研究的基础上,进一步研制成功了热涂易焊涂层——GH—1、GH—2两种合金材料。根据用户的使用报告和审测结果,电子工业部在84年6月召开会议通过了技术鉴定。认为GH—1、GH—2合金材料的易焊性涂层是一种独创。建议尽快选择工厂进行批量生产试验,同时,对“可焊性自恢复现象”的机理继续进行研究。
Department of Radio Electronics, Tsinghua University in 83 years assumed by the Ministry of Electronics Industry issued a “control of hot-dip lead-tin alloy copper core intermediate transition layer growth” of scientific research tasks. On the basis of completing the mechanism research, they successfully developed the hot-dip easy-welding coatings - GH-1 and GH-2 alloy materials. According to the user’s use of the report and the test results, the Ministry of Electronics Industry in June 84 meeting to adopt a technical appraisal. Think GH-1, GH-2 alloy material is easy to weld coating is original. It is recommended to select factories as soon as possible to carry out batch production test, meanwhile, the mechanism of “solderability self-recovery phenomenon” continues to be studied.