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Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition (CVD) in the carrier gas (N2, O2) at 220-300 °C under reduced pressure and normal pressure. The deposition of palladium complexes [ Pd((η3-allyl)(hfac) and Pd(hfac)2 ] gives pure palladium film, while the deposition of platinum needs the enhancement of palladium complex by mixing precursor platinum complex Pt(COD)Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd/Pt atomic ratios vary under different co-deposition conditions. These metal films were characterized by XPS and SEM, and show a good adhesive property.
Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition (CVD) in the carrier gas (N2, O2) at 220-300 ° C under reduced pressure and normal pressure. The deposition of palladium complexes [Pd (η3-allyl) (hfac) and Pd (hfac) 2] gave pure palladium film, while the deposition of platinum needs the enhancement of palladium complex by mixing the precursor platinum complex Pt (COD) Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd / Pt atomic diversity varies under different co-deposition conditions. These metal films were characterized by XPS and SEM , and show a good adhesive property.