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纤维增强树脂基复合材料结构件的残余应力问题是制约其在航空航天、汽车和建筑领域大规模应用的关键问题。复合材料固化过程中温度场和固化度场的非均匀性是引起残余热应力和固化收缩应力的重要因素。为了探讨纤维复合材料结构件在固化成型过程中固化工艺温度、热传导系数、对流换热系数及结构件厚度对固化均匀性的敏感程度,采用数值模拟分析了这4个关键参数对温度场和固化度场均匀性的影响规律。模拟结果表明:升高固化工艺温度,复合材料温度场的非均匀性增大,固化度场的非均匀性减小;增大对流换热系数和热传导系数,复合材料温度场和固化度场的非均匀性减小;增加复合材料结构件的厚度,复合材料温度场和固化度场的非均匀性增大。在此基础上,应用Morris全局灵敏度分析方法对4个关键参数对复合材料固化均匀性的影响程度进行定量分析,得到固化均匀性的影响因素按灵敏程度由大到小的顺序为:结构件厚度、热传导系数、固化工艺温度、对流换热系数。
The residual stress problem of FRP composites is a key issue which restricts its large-scale application in the aerospace, automotive and construction fields. The non-uniformity of the temperature field and the curing degree field in the curing process of composites is an important factor that causes residual thermal stress and curing shrinkage stress. In order to investigate the sensitivity of curing process temperature, heat transfer coefficient, convection heat transfer coefficient and thickness of structural member to curing uniformity during the process of solidification and forming, the numerical simulation was used to analyze the influence of the four key parameters on the temperature field and curing The Influence Law of Uniformity of Degree Field. The simulation results show that increasing the curing temperature increases the nonuniformity of the temperature field and decreases the nonuniformity of the curing degree field. Increasing the convective heat transfer coefficient and the heat transfer coefficient, the temperature field and the curing degree field of the composite Inhomogeneity is reduced. Increasing the thickness of the composite structure increases the nonuniformity of the temperature field and the curing field of the composite material. On this basis, Morris global sensitivity analysis method for the quantitative analysis of the impact of the four key parameters on the curing uniformity of the composite material, the curing uniformity of the influencing factors in descending order of sensitivity: structure thickness , Thermal conductivity, curing process temperature, convection heat transfer coefficient.