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机械化学抛光(CMP)工艺普遍应用于纳/微机械制造中,特别是复杂的层状结构MEMS。鉴于镍及镍基合金具有高的沉积速率、可控的薄层应力、低的电阻和制备温度以及机械特性,本文研究了镍及镍基合金用于具有运动结构的纳/微EMS器件的可行性,重点研究了基于镍的CMP工艺,其电化学势的变化用电动势极化曲线进行了分析,镍膜层表面用XPS和SEM进行了分析,结果表明:镍的刻蚀速率随着双氧水和缓蚀剂EDTA浓度中加而增加,在双氧水浓度在1%左右时达到最大。其刻蚀过程的动态和静态的电动势极化曲线具有明显不同,XPS分析表明:无双氧水的刻蚀液薄膜表面主要是形成N iO,存在H2O2的刻蚀液薄膜表面主要是形成N i(OH)2,表面的镍所处的电化学状态是影响刻蚀行为的主要原因。
Mechanochemical polishing (CMP) processes are commonly used in nano / micromachine manufacturing, especially complex layered structure MEMS. In view of the high deposition rate, controlled thin-layer stress, low resistance and preparation temperature and mechanical properties of nickel and nickel-based alloys, this paper studies the feasibility of nickel and nickel-based alloys for nano / micro EMS devices with moving structures The research focused on the nickel-based CMP process. The change of electrochemical potential was analyzed by the electromotive force polarization curve. The surface of the nickel film was analyzed by XPS and SEM. The results showed that the etching rate of nickel increased with the decrease of hydrogen peroxide The etchant EDTA concentration in the increase, at a hydrogen peroxide concentration of about 1% to reach the maximum. XPS analysis shows that the surface of the etching solution film without hydrogen peroxide mainly forms N iO, and the surface of the etching solution film with H2O2 mainly forms N i (OH ) 2, the surface of the electrochemical state of nickel is the main reason affecting the etching behavior.