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美国国家半导体公司(NationalSemiconductor)推出一种称为microSMDxt的全新芯片封装技术,这是原有microSMD封装的技术延伸,是一种新型晶圆级封装技术。美国国家半导体两款全新的Boomer音频放大器率先采用了这种microSMDxt封装,据称可为电路板节省高达70%的空间。这种封装在保留
National Semiconductor introduced a new chip packaging technology called microSMDxt, a technology extension of the original microSMD package and a new wafer-level packaging technology. National’s two new Boomer audio amplifiers are the first to be implemented in this microSMDxt package and are said to save up to 70% of board space. This package is reserved