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国际商用机械公司(IBM)的研究人员已经研制了一种新的试验性的电镀工艺,它用激光来加速金属在一小面积上的沉积。该工艺可使电子电路中用的小型金属图象的生产方法简化,这样,在制作传统的光刻电路时就没有必要铺上“掩模”了。IBM 的冯·格费尔德在电化学学会半年一次的
Researchers at International Business Machines Corp. have developed a new pilot electroplating process that uses lasers to accelerate the deposition of metals over a small area. This process simplifies the production of small metal images for use in electronic circuits, thus eliminating the need for “masking” when making a conventional lithography circuit. IBM von Gerfeld in the electrochemical society once every six months