论文部分内容阅读
利用响应面分析方法优化了用于压力传感器硅敏感芯体的刻蚀操作条件。主要考虑了温度、KOH浓度和腐蚀时间三个操作参数,将它们的范围分别设定为40~60℃,0.4~0.48mol/L和5~12.5h,并设定各向异性腐蚀速率为响应值。通过建立二次方模型,分析这些参数的单独影响以及多个操作条件之间对腐蚀速率的相互交叠作用。分析结果表明:模型可以精确预测99%的响应值,相比于腐蚀时间,溶液浓度和工作温度对刻蚀速率的影响更为明显。
Response surface analysis is used to optimize the etching conditions for the silicon-sensitive pressure sensor core. The three operating parameters of temperature, KOH concentration and etching time are mainly considered, and their ranges are set to 40-60 ℃, 0.4-0.48mol / L and 5-12.5h respectively, and the anisotropic corrosion rate is set as the response value. By establishing a quadratic model, the individual effects of these parameters and the interaction of corrosion rates over multiple operating conditions are analyzed. The analysis results show that the model can accurately predict the response of 99%. Compared with the etching time, the effect of solution concentration and working temperature on the etching rate is more obvious.