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美国空军电子封装及ＭＣＭ技术规划概要美国空军（ＵＳＡＦ）多芯片组件（ＭＣＭ）先进封装技术研究及其支持活动主要集中在ＵＳＡＦ试验室中的ＰＬ（Ｐｈｉｌｌｉｐｓ）、ＲＬ（Ｒｏｍｅ）、ＷＬ（Ｗｒｉｇｈｔ）试验室和空军技术研究所（ＡｉｒＦｏｍｅＩｎｓｔｉ－ｔｕ...
Summary of US Air Force Electronic Packaging and MCM Technology Programs The USAF Multi-Chip Module (MCM) advanced packaging technology research and support activities are mainly focused on PL (Phillips), RL (Rome), WL (Wright) Laboratory and Air Force Institute of Technology (AirFomeInsti ...