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近年来,国外采用表面贴装技术把片式元件固定在印刷电路板上,取代了标准的DIP和带轴向/径向引线元件的组装技术。这一技术的更新,导致了片式电子元件的迅猛发展,并广泛用于各种消费类电子产品中。本文主要介绍日本新近生产的几种片式体声波(BAW)器件和声表面波(SAW)器件的结构、制法,及其主要性能和应用。
In recent years, the use of surface mount technology to foreign chip components fixed on the printed circuit board, replacing the standard DIP and with axial / radial lead components assembly technology. This technology update led to the rapid development of chip electronic components, and is widely used in a variety of consumer electronics products. This article mainly introduces the structure, fabrication method, main performance and application of several kinds of BAW devices and surface acoustic wave devices (SAW) recently produced in Japan.