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本文介绍了一种金属喷涂与抛丸处理同时进行的新工艺(SSP),它将金属喷涂沉积与同时进行的抛丸处理结合在一起。这一组合工艺既能用于黑色金属或非黑色金属组成的厚涂层,又能用于薄涂层。沉积层在此过程中受到热加工并且致密化,因之与常规的喷涂积层相比其性能得到了改善。另外一个优点是喷涂积层所固有的残余张应力被抛丸所引起的压应力平衡了。通过控制同时进行的抛丸操作,该工艺所形成沉积层的残余应力能保持任何所需要的正值或负位。本文对这一新工艺下由气体雾化金属、电弧喷涂、等离子喷涂所形成的产品,提供了部分实例及其结构。
This article describes a new process (SSP) of simultaneous metal spraying and shot blasting that combines metal spray deposition with simultaneous shot blasting. This combination process can be used both for thick coatings made of ferrous or non-ferrous metals as well as for thin coatings. The deposit is thermally processed and densified during this process, as its properties are improved compared to conventional spray lays. Another advantage is that the residual tensile stress inherent in the spray buildup is balanced by the compressive stress caused by shot blasting. By controlling the simultaneous shot blasting operation, the residual stress of the deposited layer formed by the process retains any desired positive or negative position. In this paper, the gas atomized metal, arc spray and plasma sprayed products under this new process are provided as examples and structures.